- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5350
10-year publication summary
512
|
622
|
687
|
604
|
561
|
586
|
563
|
424
|
364
|
101
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
631 |
Disco Corporation | 1745 |
473 |
Infineon Technologies AG | 8189 |
214 |
Semiconductor Components Industries, L.L.C. | 5345 |
203 |
Samsung Electronics Co., Ltd. | 131630 |
164 |
Texas Instruments Incorporated | 19376 |
149 |
Applied Materials, Inc. | 16587 |
149 |
Micron Technology, Inc. | 24960 |
148 |
Intel Corporation | 45621 |
76 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
67 |
Renesas Electronics Corporation | 6305 |
57 |
Kioxia Corporation | 9847 |
52 |
STATS ChipPAC Pte. Lte. | 1516 |
51 |
NXP USA, Inc. | 4155 |
48 |
Plasma-therm, LLC | 88 |
46 |
Hamamatsu Photonics K.K. | 4161 |
43 |
Advanced Semiconductor Engineering, Inc. | 1546 |
41 |
Xintec Inc. | 265 |
38 |
Infineon Technologies Austria AG | 1954 |
37 |
Mitsubishi Electric Corporation | 43934 |
37 |
Other owners | 2626 |